MTP TO LC MODULES

MTP TO LC MODULES

The Fibernet STAR MTP®-LC modules are the workhorse of the STAR system: high-density, pre-terminated breakout cassettes with one MTP® adapter at the rear and 12 LC connections at the front – presenting each backbone trunk as clean, patchable LC ports for equipment. Supporting 12 LC simplex or 6 LC duplex patch cords per module and Ethernet applications of up to 50 Gb/s per fiber, they connect data center backbone and horizontal structured cabling to the switch port in one plug-and-play step.

What sets the STAR MTP®-LC apart is graded optical performance: modules are available in Standard, Low Loss and Ultra-Low Loss versions, with the multimode Ultra-Low Loss grade reaching a maximum module insertion loss of just 0.35 dB (LC connection 0.1 dB, MTP® 0.25 dB). In link-budget terms, lower loss per cassette means more mated connections per channel and longer reachable distances – exactly what TIA-942 structured cabling architectures demand as speeds climb. Combined with bend-insensitive fibers and Uni-Boot patch cords that cut front cabling volume by up to 50%, the module delivers density without compromise.

  • One MTP® in, 12 LC out – a single rear MTP® adapter breaks out to 12 front LC connections (12 simplex / 6 duplex) in a compact, space-saving cassette
  • Three loss grades – Standard, Low Loss and Ultra-Low Loss versions let you match cassette performance to the link budget; MM Ultra-Low Loss: 0.35 dB max module IL
  • Up to 50 Gb/s per fiber – supports current and next-generation Ethernet applications; ETL lab verified up to 100G Ethernet per IEEE 802.3ab-2010
  • Fits all STAR ODF series – slides into any tray of the 1U, 1U-FX, 2U and 4U, alongside any other STAR module
  • Uni-Boot patch cord ready – bend-insensitive Uni-Boot cords reduce front cabling volume by up to 50% compared to duplex patch cords
  • Bend-insensitive fibers throughout – OM3, OM4, OM5 and SM G.657.A2 allow tight routing in constrained space without risk of fiber damage
  • Fast, error-free MACs – sliding pull-out trays with front, side and rear access, built-in labeling chart, and colored patch cord routing guides in each tray for network differentiation
  • Laser and dust protection – LC adapters with internal shutters eliminate eye exposure to lasers; all LC and MTP® connectors ship with dust caps
  • Tested, not assumed – every module undergoes ferrule geometry and IL & RL testing; single-mode APC versions deliver return loss better than -60 dB (8° angle polish)

The MTP®-LC breakout module shall be a pre-terminated cassette in a modular enclosure format. The module shall meet the following requirements:

  • Shall be mechanically compatible with all Fibernet STAR ODF series enclosures
  • Shall provide one MTP® adapter at the rear breaking out to 12 LC connections at the front, supporting 12 LC simplex or 6 LC duplex patch cords
  • Shall support Ethernet applications of up to 50 Gb/s per fiber
  • Shall be available in Standard, Low Loss and Ultra-Low Loss performance grades
  • Shall provide, in the multimode Ultra-Low Loss grade, a maximum module insertion loss of 0.35 dB with maximum connection insertion loss of 0.1 dB (LC) and 0.25 dB (MTP®)
  • Shall provide, in the multimode Low Loss grade, a maximum module insertion loss of 0.5 dB with maximum connection insertion loss of 0.15 dB (LC) and 0.35 dB (MTP®)
  • Shall provide, in the single-mode APC Ultra-Low Loss grade, a maximum module insertion loss of 0.5 dB, and in the single-mode APC Low Loss grade 0.75 dB
  • Shall provide maximum module return loss better than -35 dB (multimode) and better than -60 dB (single-mode, 8° angle polish)
  • Shall use bend-insensitive fibers: OM3, OM4 and OM5 per IEC 60793-2-10:2019 and SM per ITU-T G.657.A2
  • Shall provide LC adapters with internal shutters eliminating eye exposure to lasers, and dust caps on all LC and MTP® connectors
  • Shall support bend-insensitive Uni-Boot patch cords reducing front cabling volume by up to 50% compared to duplex patch cords
  • Shall provide colored patch cord routing guides and a built-in labeling chart
  • Shall undergo ferrule geometry testing and insertion loss and return loss (IL & RL) testing
  • Shall be ETL lab verified per IEEE 802.3ab-2010 up to 100G Ethernet, and ETL certified
  • Shall operate at -10°C to +60°C
  • Shall have dimensions of 136 x 98 x 12 mm (D x W x H)
  • Shall comply with IEEE 802.3ae, IEEE 802.3ba, IEC 11801, TIA-604-5 (MPO FOCIS 5), TIA-604-10 (LC FOCIS 10), TIA-568-C.3, TIA-942-A, GR-449-CORE, UL94 V-0 and RoHS
Parameter MM Ultra-Low Loss MM Low Loss SM Ultra-Low Loss (APC) SM Low Loss (APC)
Max. module insertion loss 0.35 dB 0.5 dB 0.5 dB 0.75 dB
Max. connection IL – LC 0.1 dB 0.15 dB 0.15 dB 0.15 dB
Max. connection IL – MTP® 0.25 dB 0.35 dB 0.35 dB 0.60 dB
Max. module return loss > -35 dB > -60 dB (8° angle polish)
Front presentation 12 LC simplex / 6 LC duplex
Rear presentation 1 x MTP® adapter
Operating temperature -10°C to +60°C
Dimensions (D x W x H) 136 x 98 x 12 mm
Packed weight 0.13 kg (0.3 lbs.)
Compliance IEEE 802.3ab-2010 (ETL verified up to 100G) / 802.3ae / 802.3ba, IEC 11801, TIA-604-5, TIA-604-10, TIA-568-C.3, TIA-942-A, GR-449-CORE, UL94 V-0, RoHS

Build your part number: FSTAR-[Fiber]LC[Polish][Loss grade]

Position Options
Fiber type G = OM3 BI  |  O = OM4 BI  |  W = OM5 BI  |  7 = SM G.657.A2 BI
Polish type U = UPC  |  A = APC
Loss grade (none) = Standard  |  E = Low Loss  |  L = Ultra-Low Loss

Example: FSTAR-GLCUL = OM3, UPC polish, Ultra-Low Loss MTP®-LC module.